- 4Gb through 32Gb are available
- 16Gb components available in x4 organization in FBGA-78 package
- Double data rate clocking timing, 1.2V Power Supply
- Supported Data Bus Inversion (DBI)
- Supported Write Cycle Redundancy Check (CRC)
- Supported Dynamic ODT (On Die Termination)
- Supported Fine Granularity Refresh Mode
- High speed data transfer up to 3200MHz
DRAM Components - DDR4
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DDR4 Components | ||||||
---|---|---|---|---|---|---|
Density | Org | Max Speed (Data Rate Mbps) | Packages | *Temperature | ECC | AEC-Q100 |
32Gb | x8, x16 | 1600MHz (3200Mbps) | FBGA-78, FBGA-96 | Commercial, Industrial | N | Contact IM |
16Gb | x4, x8, x16 | 1600MHz (3200Mbps) | FBGA-78, FBGA-96 | Commercial, Industrial | N | Contact IM |
8G | x8, x16 | 1600MHz (3200Mbps) | FBGA-78, FBGA-96 | Commercial, Industrial | N | Contact IM |
4Gb | x8, x16 | 1333MHz (2666Mbps) | FBGA-78, FBGA-96 | Commercial, Industrial | N | Contact IM |
*Commercial = 0°C to +95°C / Industrial = -40°C to +95°C / High = -40°C to +105°C